Physical-first
Every track connects to actuation, sensing, embodiment or deployment.
About ICPAIAS 2027
An international academic–industry forum on intelligence that acts in the physical world.
The conference
From digital reasoning to real-world autonomous action
Between 2023 and 2026, applied AI moved through three stages: generative models, then tool-using agents, then agents coupled to physical actuation. Terms like physical AI, agentic AI, embodied intelligence, world models and vision-language-action models now describe a field in its own right — but its research is still scattered across robotics, AI, control and manufacturing venues.
The International Conference on Physical Agentic Intelligence and Autonomous Systems (ICPAIAS 2027) brings that work together. Organised by Pimpri Chinchwad University in Pune — at the centre of India’s automotive, robotics and manufacturing ecosystem — with Hamburg University of Technology (TUHH), Germany, as technical partner, it convenes researchers, engineers, industry practitioners and policy voices working on agentic AI, physical and embodied intelligence, autonomous systems and the assurance frameworks that make them deployable.
The two-day, in-person programme includes nine technical tracks, international keynotes and invited talks, parallel paper and poster sessions, and panels on deployment and on safety and standards.
Vision
To establish India’s definitive academic–industry forum on physical and agentic intelligence — where research on autonomous decision-making meets the machines, factories, vehicles and infrastructure that must execute it safely.
Mission
- Convene researchers and practitioners across AI, robotics, control, embedded systems, manufacturing and safety engineering who currently publish in separate silos.
- Give Indian PhD scholars and early-career faculty an internationally reviewed venue on their own soil, at a fraction of the cost of overseas conferences.
- Turn industry problems from the Pune–Mumbai–Aurangabad corridor into research questions, and research results into demonstrable prototypes.
- Build a lasting, recurring forum rather than a one-off event.
What we stand for
Our principles
Industry-connected
Industry practitioners sit on the Technical Program Committee, speak in keynotes and panels, and respond to papers in the Deploy-or-Don’t panel.
Rigour-visible
Double-blind review, at least three reviews per paper, similarity and AI-use screening on every submission, and acceptance statistics published after the event.
Globally networked
An international Advisory Committee and Technical Program Committee, international track co-chairs, and Hamburg University of Technology (TUHH), Germany, as technical partner.
Sustainable series
ICPAIAS is planned as a recurring series. A Steering Committee will be constituted in 2027, and the next edition announced at the valedictory.
Accessible
An internationally reviewed venue in India, with a virtual session for international authors who cannot travel.
What makes ICPAIAS different
Six commitments, each one operational
- Published review statistics. Submissions, reviews per paper, acceptance rate, desk rejections and plagiarism rejections are published within 30 days of the event.
- Deploy-or-Don’t panel. Industry practitioners respond to three selected academic papers: would we deploy this, and what is missing?
- Safety & assurance statement. Every submission includes a structured deployment-risk and limitations statement.
- Two-tier mentorship. Every accepted student first-author is paired with a TPC mentor for a 20-minute pre-presentation clinic on 19 February 2027.
- Reproducibility badge. Optional code, data or artifact submission earns a visible badge in the programme.
- Series continuity. The dates and host of the next edition are announced at the 2027 valedictory.
Who should attend
What each participant gets
| Participant | What you get |
|---|---|
| PhD scholars and research students | An internationally reviewed venue at Indian cost, a mentorship clinic and a presentation certificate. |
| Faculty | Publication, TPC and session-chair roles, and collaboration with national and international peers. |
| Industry | Research collaboration, a talent pipeline, and a voice in keynotes, panels and paper sessions. |
| International participants | Access to India’s manufacturing and robotics ecosystem, collaboration opportunities and a high-value visit. |
Pimpri Chinchwad University
Pimpri Chinchwad University (PCU), Pune, is a multidisciplinary university spanning engineering, design, management, pharmacy and the sciences — a structure that maps directly onto a theme that is inherently cross-disciplinary. ICPAIAS is PCU’s flagship international conference in engineering and computing.
Hamburg University of Technology (TUHH)
Hamburg University of Technology (Technische Universität Hamburg, TUHH) is a research university of engineering and technology, founded in 1978 and located in Harburg, in the south of Hamburg, Germany. TUHH is the technical partner of ICPAIAS 2027.
Why Pune
Pune is one of India’s densest concentrations of automotive, robotics, manufacturing-automation and embedded-systems capability, alongside a very large engineering-education base. A conference on physical AI held in Pune has a natural industrial audience — from OEMs and Tier-1 suppliers in the Chakan belt to automation integrators and deep-tech startups.